Clip module and heat dissipation device having the same

ABSTRACT

A clip module and a heat dissipation device having the same are disclosed, wherein the heat dissipation device is suitable to dissipate the heat for a heat source on a circuit board. The heat dissipation device includes a retention module, a heat sink and a clip module. The retention module is provided on the circuit board and around the heat source, and the heat sink is provided on the heat source. The clip module includes a body, a fastener fastened to the retention module and a pressing structure. The pressing structure includes a first triangle block and a second triangle block which is slidably provided on two adjacent surfaces of the first triangle block, and the fastener is pivotally provided at the second triangle block.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 96127746, filed on Jul. 30, 2007. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a clip module and, more particularly, to a clipmodule and a heat dissipation device having the same.

2. Description of the Related Art

In recent years, along with the enormous progress of the science andtechnology, the operating speed of transistors (such as a chip set)included in various electronic components becomes higher and higher, sothat the working temperature of the electronic components also becomeshigher and higher. Taking a central processing unit (CPU) of a computerdevice as an example, since the operating speed of the CPU iscontinuously increased, the heat generating power of the CPU alsocontinuously rises. To prevent the CPU from being overheated and thecomputer device from loosing effectiveness temporarily or permanently,the computer device needs to have sufficient heat dissipation ability toenable the CPU to work normally. To dissipate the heat energy generatedby the CPU which works with a high speed and to make the CPU maintainthe normal state when the CPU works with the high speed, in theconventional technology, a heat dissipation device is directly assembledon the CPU (or other heat generating chip) to make the heat energygenerated by the CPU rapidly dissipated to the ambient environment viathe heat dissipation device.

FIG. 1A is a three-dimensional schematic diagram showing a conventionalheat dissipation device provided on a heat source, and FIG. 1B is anexploded diagram showing the heat dissipation device and the heat sourcein FIG. 1A. Please refer to FIG. 1A and FIG. 1B, simultaneously, and aconventional heat dissipation device 100 is provided in a computer hostto dissipate the heat for a heat source 10 such as a CPU. The heatdissipation device 100 includes a retention module 110 which is providedaround the heat source 10, a heat sink 120 and a clip module 130. Theheat sink 120 is suitable to be provided on the heat source 10 todissipate the heat for the heat source 10, and the clip module 130 issuitable to be provided across the heat sink 120 and apply a downwardpressure to the heat sink 120 to make the heat sink 120 tightly attachedto the heat source 10. In this way, the heat energy in the heat source10 can be effectively conducted to the heat sink 120, and further bedissipated to the ambient environment via the heat sink 120.

In the conventional technology, the clip module 130 includes a body 132provided across the heat sink 120, a fastener 134 and a pressingstructure 136. The body 132 is suitable to press against the heat sink120 to make the heat sink 120 tightly attached to the heat source 10.One end of the body 132 is fastened to a tenon 112 of the retentionmodule 110, and the fastener 134 is assembled to the other end of thebody 132, and the fastener 134 is suitable to be fastened to anothertenon 114 of the retention module 110. In addition, the pressingstructure 136 is pivotally connected to the fastener 134 via a bolt 138.The pressing structure 136 can rotate along the pivotal axis L1 (X axis)of the bolt 138 to apply a downward pressure to the body 132.

The pressing structure 136 of the above conventional clip module 130 isan eccentric structure, that is, the rotary axis center of the pressingstructure 136 is not located at the center of the pressing structure136, and therefore, when a user rotates the pressing structure 136, therotation radius of the pressing structure 136 gradually increases. Aboutthe further illustration for the pressing structure 136, please refer toFIG. 1C and FIG. 1D, simultaneously. FIG. 1C is a schematic diagramshowing the clip module which is shown in FIG. 1A and is not fastened toa retention module, and FIG. 1D is a schematic diagram showing the clipmodule which is shown in FIG. 1C and is fastened to a retention module.In FIG. 1D, the rotation radius R2 of the pressing structure 136 isgreater than the rotation radius R1 of the pressing structure 136 inFIG. 1C. Therefore, the pressing structure 136 can press the connectingpart 132 a of the body 132 to make the connecting part 132 a move for adistance during the rotation process, so that the connecting part 132 acan move downward along the Z axis and the body 132 can apply a downwardpressure to the heat sink 120. In this way, the heat sink 120 can betightly attached to the heat source 10.

The pressing structure 136 is made of plastic which has a high cost, andhas a more complicated structure and more components, and therefore, theconventional clip module 130 has a higher production cost. In addition,since the pressing structure 136 rotates along the pivotal axis L1 (Xaxis) of the bolt 138 to apply a downward pressure to the body 132, whenthe heat sink 120 is assembled on the heat source 10, sufficient spacearound the heat sink 120 needs to be supplied for the rotation of thepressing structure 136 further to make the heat sink 120 successfullyassembled on the heat source 10. However, at the interior of thecomputer host, the space around the heat sink 120 is limited (variouselectronic components such as a memory module, various cards, etc. maybe provided around the heat sink 120), and therefore, during the processof assembling the heat sink 120 to the heat source 10, when the pressingstructure 136 pivotally connected to the fastener 134 rotates, thepressing structure 136 easily interferes with the electronic componentsaround the heat sink 120 because of the limited space, so that the heatsink 120 is difficult to be assembled on the heat source 10.

BRIEF SUMMARY OF THE INVENTION

The objective of the invention is to provide a clip module which has asimple structure, convenient operation and a low production cost.

Another objective of the invention is to provide a heat dissipationdevice having a clip module to solve the problem that the clip module iseasy to interfere with electronic components around a heat sink duringthe process of assembling the heat sink to a heat source.

To achieve the above or other objectives, the invention provides a clipmodule which is suitable to cooperate with a retention module to fix aheat sink to a heat source. The retention module has a first fasteningpart and a second fastening part. The clip module includes a body, afastener and a pressing structure. The body has a pressing part, a thirdfastening part and a connecting part, wherein the third fastening partand the connecting part are located at two ends of the pressing part.The pressing part is used to make the heat sink press against the heatsource, and the third fastening part is used to be fastened to the firstfastening part. The fastener has a guiding part and a fourth fasteningpart, wherein the fourth fastening part is used to be fastened to thesecond fastening part. The pressing structure has a first triangle blockand a second triangle block. The first triangle block has a firstlateral surface, a second lateral surface, a third lateral surface and aguiding hole. The first lateral surface leans against the connectingpart; the second triangle block leans against the second lateral surfaceor the third lateral surface in a sliding mode; the guiding part passesthrough the connecting part and the guiding hole and is pivotallyprovided at a pivotal connecting end of the second triangle block. Whenthe second triangle block slides to the third lateral surface from thesecond lateral surface, the guiding part slides from a first position onthe second lateral surface and near the first lateral surface to asecond position on the third lateral surface and away from the firstlateral surface further to make the pressing structure apply force tothe body.

In one embodiment of the invention, the guiding part and the fourthfastening part are provided at two ends of the connecting part,respectively.

In one embodiment of the invention, the guiding hole extends from thefirst lateral surface to the second lateral surface and part of thethird lateral surface.

In one embodiment of the invention, the guiding part is pivotallyprovided on a pivot of the second triangle block.

To achieve the above or other objectives, the invention further providesa heat dissipation device which is suitable to dissipate the heat for aheat source on a circuit board. The heat dissipation device mostlyincludes a retention module, a heat sink and a clip module. Theretention module is provided on the circuit board and around the heatsource, wherein the retention module has a first fastening part and asecond fastening part. The heat sink is provided on the heat source. Theclip module is provided across the heat sink and is fastened to theretention module. The clip module includes a body, a fastener and apressing structure. The body has a pressing part, a third fastening partand a connecting part, wherein the third fastening part and theconnecting part are located on two ends of the pressing part. Thepressing part is used to make the heat sink press against the heatsource, and the third fastening part is used to be fastened to the firstfastening part. The fastener has a guiding part and a fourth fasteningpart, wherein the fourth fastening part is used to be fastened to thesecond fastening part. The pressing structure has a first triangle blockand a second triangle block. The first triangle block has a firstlateral surface, a second lateral surface, a third lateral surface and aguiding hole. The first lateral surface leans against the connectingpart; the second triangle block leans against the second lateral surfaceor the third lateral surface in a sliding mode; the guiding part passesthrough the connecting part and the guiding hole, and is pivotallyprovided at a pivotal connecting end of the second triangle block. Whenthe second triangle block slides to the third lateral surface from thesecond lateral surface, the pivotal connecting end slides from a firstposition on the second lateral surface and near the first lateralsurface to a second position on the third lateral surface and away fromthe first lateral surface further to make the pressing structure applyforce to the body.

In one embodiment of the invention, the guiding part and the fourthfastening part are provided at two ends of the connecting part,respectively.

In one embodiment of the invention, the guiding hole extends from thefirst lateral surface to the second lateral surface and part of thethird lateral surface.

In one embodiment of the invention, the guiding part is pivotallyprovided on a pivot of the second triangle block.

The pressing structure of the invention utilizes the cooperation of twotriangle blocks and a fastener pivotally connected to one of the twotriangle blocks to make a heat sink firmly provided on a heat source.Therefore, compared with the conventional clip module, the clip moduleof the invention has a simple structure, fewer components, convenientoperation and a low production cost.

These and other features, aspects, and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims, and accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is a three-dimensional schematic diagram showing a conventionalheat dissipation device provided on a heat source.

FIG. 1B is an exploded diagram showing the heat dissipation device andthe heat source in FIG. 1A.

FIG. 1C is a schematic diagram showing the clip module which is shown inFIG. 1A and is not fastened to a retention module.

FIG. 1D is a schematic diagram showing the clip module which is shown inFIG. 1C and is fastened to a retention module.

FIG. 2A is a three-dimensional schematic diagram showing a heatdissipation device provided on a heat source according to the preferredembodiment of the invention.

FIG. 2B is an exploded diagram showing the heat dissipation device andthe heat source in FIG. 2A.

FIG. 3 is an exploded diagram showing the clip module in FIG. 2B.

FIG. 4A is a front view showing the heat dissipation device provided ona heat source in FIG. 2A.

FIG. 4B is a lateral view showing the heat dissipation device in FIG.4A.

FIG. 5A is a front view showing the fastening mechanism fastened to aretention module in FIG. 4.

FIG. 5B is a lateral view showing the heat dissipation device in FIG.5A.

DETAILED DESCRIPTION OF THE EMBODIMENTS

FIG. 2A is a three-dimensional schematic diagram showing a heatdissipation device provided on a heat source according to the preferredembodiment of the invention, and FIG. 2B is an exploded diagram showingthe heat dissipation device and the heat source in FIG. 2A. Please referto FIG. 2A and FIG. 2B simultaneously, and a heat dissipation structure200 of the embodiment is suitable to dissipate the heat for a heatsource 22 on a circuit board 20 and includes a retention module 210, aheat sink 220 provided on the heat source 22 and a clip module 230.

In the embodiment, the retention module 210 is provided on the circuitboard 20 and around the heat source 22, and the retention module 210 hasa first fastening part 212 and a second fastening part 214. In addition,the heat sink 220 is, for example, an extrusion heat sink or otherappropriate type of heat sink, and the clip module 230 is providedacross the heat sink 220 and is fastened to the first fastening part 212and the second fastening part 214 of the retention module 210. The chipmodule 230 of the embodiment is illustrated in detail hereinbelow.

FIG. 3 is an exploded diagram showing the clip module in FIG. 2B. Pleaserefer to FIG. 2B and FIG. 3, simultaneously. The clip module 230 of theembodiment includes a body 232, a fastener 234 and a pressing structure236. The body 232 has a pressing part 232 a, a third fastening part 232b located at one end of the pressing part 232 a and a connecting part232 c located at the other end of the pressing part 232 a. In theembodiment, the heat sink 220 has, for example, a notch 220 a, and thepressing part 232 a of the body 232 is suitable to be provided throughthe notch 220 a of a fin assembly 224 and press against the heat sink220, and the third fastening part 232 b is suitable to be fastened tothe first fastening part 212.

The fastener 234 has a guiding part 234 a and a fourth fastening part234 b, and the guiding part 234 a of the fastener 234 is provided at theconnecting part 232 c, and the fourth fastening part 234 b is suitableto be fastened to the second fastening part 214. In the embodiment, thefirst fastening part 212 and the second fastening part 214 have a hook,respectively, and the third fastening part 232 b and the fourthfastening part 234 b have a fastening hole, respectively, so that thethird fastening part 232 b can be fastened to the first fastening part212, and the fourth fastening part 234 b can be fastened to the secondfastening part 214. Certainly, in other embodiments, the first fasteningpart 212 and the second fastening part 214 can have fastening holes, andthe third fastening part 232 b and the fourth fastening part 234 b canhave hooks, and they are not limited in the invention.

The pressing structure 236 is mostly composed of a first triangle block2362 and a second triangle block 2364. The first triangle block 2362 hasa first lateral surface S1, a second lateral surface S2 and a thirdlateral surface S3. In addition, the interior of the first triangleblock 2362 has a guiding hole H which extends from the first lateralsurface S1 to the second lateral surface S2 and part of the thirdlateral surface S3. The first lateral surface S1 leans against theconnecting part 232 c, and the second triangle block 2364 leans againstthe second lateral surface S2 or the third lateral surface S3 of thefirst triangle block 2362 in a sliding mode. In addition, the guidingpart 234 a of the fastener 234 can pass through the connecting part 232c and the guiding hole H and is pivotally provided at a pivotalconnecting end P of the second triangle block 2364. In this way, whenthe second triangle block 2364 moves, the fastener 234 pivotallyprovided on the second triangle block 2364 can move along with themovement of the second triangle block 2364.

The above paragraphs mostly illustrate connection relationships betweeneach component of the clip module 230, the retention module 210 and theheat sink 220. How to fasten the clip module 230 to the retention module210 further to fix the heat sink 220 to the heat source 22 isillustrated in detail hereinbelow.

FIG. 4A is a front view showing the heat dissipation provided on a heatsource in FIG. 2A, and FIG. 4B is a lateral view showing the heatdissipation device in FIG. 4A. FIG. 5A is a front view showing thefastening mechanism fastened to a retention module in FIG. 4, and FIG.5B is a lateral view showing the heat dissipation device in FIG. 5A.Please refer to FIG. 4A and FIG. 4B first. When a user wants to fix theheat sink 220 at the heat source 22, he can make the third fasteningpart 232 b of the body 232 fastened to the first fastening part 212 ofthe retention module 210 and then make the fourth fastening part 234 bof the fastener 234 fastened to the second fastening part 214 of theretention module 210. In this way, the pressing part 232 a of the body232 can press against the heat sink 220. When the user does not applyforce to the pressing structure 236, the second triangle block 2364leans against the second lateral surface S2 of the first triangle block2362, and at this moment, the guiding part 234 a pivotally provided onthe pivotal connecting end P is located at a first position P1 on thesecond surface S2 and near the first lateral surface S1, and the leastdistance between the guiding part 234 a and the first lateral surface S1is a first distance D1.

Next, as shown in FIG. 4B, when the user press a pressing surface S ofthe second triangle block 2364 downward, please refer to FIG. 5A andFIG. 5B, and the second triangle bock 2364 can slide to the thirdsurface S3 of the first triangle block 2362 from the second surface S2of the first triangle block 2362. At this moment, the guiding part 234 apivotally provided on the pivotal connecting end P can slide to a secondposition P2 on the third surface S3 from the first position P1. When theguiding part 234 a slides to the second position P2 from the firstposition P1, the least distance between the guiding part 234 a and thefirst lateral surface S1 is a second distance D2 which is greater thanthe first distance D1. Since the fourth fastening part 234 b of thefastener 234 is fastened to the second fastening part 214 of theretention module 210, when the guiding part 234 a pivotally provided atthe second triangle block 2362 slides to the second position P2 from thefirst position P1, the pressing structure 236 can press the connectingpart 232 c of the body 232 to move downward for a distance (the distancebetween the guiding part 234 a of the fastener 234 and the connectingpart 232 c of the body 232 is gradually increased) further to enable thebody 232 to apply a downward pressure to the heat sink 220. Therefore,the pressing structure 236 can effectively apply the downward pressureto the body 232, and the fastener 234 can also be firmly fastened to theretention module 210. In addition, the guiding part 234 a is limited bya critical point CP at the intersection place of the second lateralsurface S2 and the third lateral surface S3 and cannot slide back to thefirst position P1 from the second position P2.

In the embodiment, since the third fastening part 232 b and the fourthfastening part 234 b of the fastening mechanism are fastened to thefirst fastening part 212 and the second fastening part 214 of theretention module 210, respectively, and the body 232 of the clip module230 can also apply a downward pressure to the heat sink 220, the heatsink 220 can be firmly provided on the heat source 22.

To sum up, the pressing structure of the invention mostly utilizes thecooperation of two triangle blocks and a fastener pivotally connected toone of the two triangle blocks to make a heat sink firmly provided on aheat source. Therefore, compared with the conventional clip module, theclip module of the invention has a simple structure, fewer components,convenient operation and a low production cost.

In addition, the pressing structure of the invention only needs to movefor a shorter distance to make the body apply a pressure to the heatsink, so that the height of the fastener is lower and the whole heightof the clip module is lower than the height of the conventional clipmodule. In this way, the pressing structure pivotally provided on thefastener is not easy to interfere with electronic components around theheat sink because of the limitation of the space when the pressingstructure is pressed. That is, the clip module of the invention cansuccessfully fix the heat sink to the heat source.

Although the present invention has been described in considerable detailwith reference to certain preferred embodiments thereof, the disclosureis not for limiting the scope of the invention. Persons having ordinaryskill in the art may make various modifications and changes withoutdeparting from the scope and spirit of the invention. Therefore, thescope of the appended claims should not be limited to the description ofthe preferred embodiments described above.

1. A clip module which is suitable to cooperate with a retention moduleto fix a heat sink on a heat source, wherein the retention module has afirst fastening part and a second fastening part, the clip modulecomprising: a body having a pressing part, a third fastening part and aconnecting part, wherein the third fastening part and the connectingpart are located at two ends of the pressing part, the pressing part isused to make the heat sink press against the heat source, and the thirdfastening part is used to be fastened at the first fastening part; afastener having a guiding part and a fourth fastening part, wherein thefourth fastening part is used to be fastened at the second fasteningpart; and a pressing structure having a first triangle block and asecond triangle block, wherein the first triangle block has a firstlateral surface leaning against the connecting part, a second lateralsurface, a third lateral surface and a guiding hole, and the secondtriangle block leans against the second lateral surface or the thirdlateral surface in a sliding mode, and the guiding part passes throughthe connecting part and the guiding hole and is pivotally provided atthe second triangle block, and when the second triangle block slides tothe third lateral surface from the second lateral surface, the guidingpart slides from a first position on the second lateral surface and nearthe first lateral surface to a second position on the third lateralsurface and away from the first lateral surface further to make thepressing structure apply force to the body.
 2. The clip module accordingto claim 1, wherein the guiding part is provided at the connecting part.3. The clip module according to claim 1, wherein the guiding holeextends from the first lateral surface to the second lateral surface andpart of the third lateral surface.
 4. The clip module according to claim1, wherein the guiding part is pivotally provided on a pivot of thesecond triangle block.
 5. A heat dissipation device which is suitable todissipate the heat for a heat source on a circuit board, the heatdissipation device comprising: a retention module provided on thecircuit board and around the heat source, wherein the retention modulehas a first fastening part and a second fastening part; a heat sinkprovided on the heat source; and a clip module which is provided acrossthe heat sink and is fastened at the retention module, the clip modulecomprising: a body having a pressing part, a third fastening part and aconnecting part, wherein the third fastening part and the connectingpart are located on the pressing part, the pressing part is used to makethe heat sink press against the heat source, and the third fasteningpart is used to be fastened at the first fastening part; a fastenerhaving a guiding part and a fourth fastening part, wherein the fourthfastening part is used to be fastened at the second fastening part; anda pressing structure having a first triangle block and a second triangleblock, wherein the first triangle block has a first lateral surfaceleaning against the connecting part, a second lateral surface, a thirdlateral surface and a guiding hole, and the second triangle block leansagainst the second lateral surface or the third lateral surface in asliding mode, and the guiding part passes through the connecting partand the guiding hole and is pivotally provided at a pivotal connectingend of the second triangle block, and when the second triangle blockslides to the third lateral surface from the second lateral surface, thepivotal connecting end slides from a first position on the secondlateral surface and near the first lateral surface to a second positionon the third lateral surface and away from the first lateral surfacefurther to make the pressing structure apply force to the body.
 6. Theheat dissipation device according to claim 5, wherein the guiding partand the fourth fastening part are provided at the connecting part,respectively.
 7. The heat dissipation device according to claim 5,wherein the guiding hole extends from the first lateral surface to thesecond lateral surface and part of the third lateral surface.
 8. Theheat dissipation device according to claim 5, wherein the guiding partis pivotally provided on a pivot of the second triangle block.